This issue of the RASSP Digest describes the model year methodology being developed by the two RASSP primes. A combination of Design for Reuse and Design with Reuse is being employed. In the first article, a modular approach to system integration is proposed through the use of a standard virtual interface (SVI) that encapsulates each system component (software or hardware) in a form that encourages interoperability and rapid "plug-and-play", ensuring quick upgrades of individual modular components to implement a model year methodology. In the second article, the model year upgrade process of a 2D IRST system to improve its functionality, performance and its form factors (size weight, area and power) is presented. The use of VHDL in documenting the system from concept to manufacture is illustrated. The RASSP efforts, illustrated by these two articles, are in line with mainstream industial efforts to develop standards for open systems and universal interfaces, including extensions to operating systems to enable interoperability with a variety of peripheral components.
The remainder of this issue presents some recent results from the Technology Base contracts that focus on the architectural and front-end design of RASSP systems, and includes comparisons with current non-RASSP methodologies.
Anthony J. Gadient
SCRA
5300 International Blvd.
N. Charleston, SC 29418
gadient@scra.org