From owner-ibis  Tue Nov  2 12:36:40 1999
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Date: Tue, 02 Nov 1999 14:36:12 -0600
From: "Benjie Zeller" <ra5366@email.sps.mot.com>
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I am having some problems with defining some dummy input signals and
power planes in a S2IBIS2 template I am using.  Can anyone help?  I have
specifics, I just didn't want to send a long email to everyone on the
list.

Benj

--
Benjie Zeller
Motorola NSD FSRAM Apps. Engineer
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From owner-ibis  Fri Nov  5 08:55:38 1999
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From: fbellami@nomad1 (Fethi Bellamine)
Message-Id: <199911051642.LAA03189@nomad1.newbridge>
To: ibis-users@eda.org
Subject: Voltage dop (QA of XTK models)


 HI,

 After converting my IBIS model to an XTK model and checking for the 
 validity of the model as a driver, for example, I noticed there is
 a voltage drop (the driver is differential) more than 1V. I would expect
 a voltage drop of 0.6-0.8V but not over 1V. So I am wondering what accounts
 for the voltage drop? Thank you.

 Fethi Bellamine
 EMC/SI enginner
 Newbridge Networks
From owner-ibis  Mon Nov  8 16:19:38 1999
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From: "Trinh, Viet" <viet.trinh@intel.com>
To: "'ibis-users@vhdl.org'" <ibis-users@vhdl.org>
Subject: s2ibis !
Date: Mon, 8 Nov 1999 16:19:07 -0800 
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i have a problem to run the s2ibis_zip.exe file. i tried to drag my file
into the s2ibis.exe file.it was not working in that way. would you show me
how to run it, i really appreciate that
viet trinh,
From owner-ibis  Fri Nov 12 12:50:02 1999
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To: ibis@eda.org, ibis-users@eda.org
Subject: IBIS-X proposal
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Date: Fri, 12 Nov 1999 12:42:05 -0800
From: Stephen Peters <sjpeters@ichips.intel.com>


Hello All:

  At the recent IBIS summit there was a fair amount of discussion regarding
the future of IBIS.  Among the issues the IBIS community has been wrestling
with are:
1. the growth in complexity of the specification, 
2. support for power/gnd and return path modeling
3. receiver modeling, and 
4. the need for a general escape mechanism that allows simulators to 
incorporate user created models (models that the simulator may not otherwise 
support).

  So far, there has been a proposal for incorporating an API (application
programming interface) into IBIS, which addresses point four above.  However, 
to fully support an API I belive that the current IBIS description would have 
to change.  Specifically, models would have to become multi-ported
entities with explicit power and ground ports tied to component pins.  In 
fact, I belive to in order to fully address the problems of complexity 
(added keywords for every new type of buffer) and return path modeling there
needs to be a new, general buffer description language, one that supports IBIS
type simulators but also allows a model to be used directly by a circuit
simulator.  To that end I'm making a proposal called IBIS-X.  I am aware that
this is a fairly radical proposal (for example, it is not backwards compatible
with the existing IBIS specification), but I belive it does address directly
both the needs of those producing models as well as those designing high 
speed electrical interconnects.

Please look it over and make your comments.  This will be on the agenda at
the next IBIS phone conference.

   Best Regards,
   Stephen Peters
   Intel Corp.

-----------  cut here -----------

  The following is a proposal for a new format to be used for creating and
specifying I/O buffer models.  This format is an evolution of the current
IBIS description, and provides a couple of fundamental enhancements when
compared with the current specification.  Specifically:
  a) IBIS-X provides for much greater flexibility in model descriptions.
Buffers can be described using either the traditional IBIS prototype model
or the user may create their own buffer model by using a set of passive and
behavioral elements connected together nodally.  Nodal descriptions provide
a direct path into circuit simulators, and nodal descriptions are also used
to build arbitrary package models around a buffer.
  b) IBIS-X provides support for return path modeling.  Component power and
gnd pins are connected directly to a model instance, thus allowing true
system level simulations that incorporate board decoupling effects, ground
return effects, etc.
  c) The IBIS-X proposal provides the necessary hooks that enable
simulators to incorporate an external models thru an API.



IBIS-X COMPARED TO IBIS
  As with the original IBIS specification, the IBIS-X description is
targeted towards transmission line and board level SI simulators.  To this
end IBIS-X sticks with the "component centric" format -- each pin of a
component is listed, and pins are attached to a model witch can be used
over and over again.  Furthermore, each pin (model) is explicitly declared
as a driver or receiver and each model contains the 'data book' information
(timing test loads, Vinh/Vinl, etc.) that allows for automatic SI and
flight time analysis.  The biggest difference is that the IBIS-X
description allows a buffer/receiver model to connect not just to an I/O
pin, but also to power/gnd pin(s).  It does this by making the [Model] a
multi-port entity.  By allowing a model to have explicit power ports a
circuit type simulator (or an enhanced behavioral simulator) can modulate 
the power and ground rails of a behavioral model, thus incorporating the
effects of board level power distribution (including ground return paths)
into a simulation (i.e. enables true system level simulation).

  As mentioned above, the IBIS-X spec allows the model maker a choice of
descriptions. Model makers should be able to model a driver or receiver to
the level of detail required and/or appropriate.  Traditional I/V,V/T
descriptions are still very useful and the IBIS-X proposal fully supports a
pure behavioral description of an driver or receiver.  In other cases, the
user may want to model a buffer behaviorally, but surround the buffer with
a package model consisting of a network of R/L/Cs (a SPICE like
description). Therefore, the IBIS-X proposal allows the guts of a model to
be a nodal network consisting of passive components, some basic independent
and dependent sources, and submodels.  In turn, a submodel can consist of
behavioral descriptions, nodal networks, more submodels, or a coupling
matrix (used to describe pin coupling).  By using a approach based on nodal
description and submodels, it should be straightforward to incorporate a
package model around a buffer, or to group buffers together to simulation
SSO effects, etc.


 Finally, the IBIS-X proposal prepares the way for a behavioral simulator
to execute transistor level models by allowing a model or submodel to call
an external model which is executed via an API.  I should point out that
adding an API to the existing IBIS specification is possible, but to make
it useful there still needs to be some mechanism to define/declare a
multi-port model and associate those ports with the various [Voltage]
keywords of the current spec and the pins of the component.


========= Details, and a shot at syntax ==============

FILE HEADER 
The file header info remains pretty much the same as in
the current IBIS spec.

[Template Version]   version #
[Comment Char]       | by default
[File Name]          file name.ibx
[Date]               date
[Source]             ASCII text 
[Notes]              ASCII text 
[Disclaimer]         ASCII text 
[Copyright]          ASCII text 


COMPONENT SECTION
The major function of the component section is to map the component pins
to a model.  However, instead of calling out just a model the [Pin] keyword
connects pins to a specific port on a model.  The [Model Selector]
functionality is retained, along with the [Diff Pin] keyword. However, the
[Diff Pin] keywords function has been changed to list only skew between
differential outputs only. (Note: To aid parsing each "section" of the spec
begins with a [Begin "Section Name"] keyword and ends with an [End "Section
Name"] keyword.


[Begin Component]
[Component]          component name
[Manufacture]        manufactures name
[Pin]
pin_name  signal_name  model_name  port_name  R_pin  L_pin  C_pin 
(Note: only a *model_name* is allowed, not a submodel name.  To support
IBIS compatible descriptions NC, PWR and GND are legal pin connections, and
a generic R_pin, L_pin and C_pin can be included.)


[Diff Pin]
inverting_pin  non_inverting   skew_typ  skew_typ  skew_max

[Model Selector]
[End Component]



MODEL SECTION
The purpose of the model section is to identify the top model type (input,
output, bidir, etc.), list the data book specs that support SI simulators
and board level timing products (timing test loads, input parameters,
etc.), define the ports of the model and finally, provide a place to put
the guts of a model.

[Begin Model]           model_name
model_type =            select from list
C_comp* =               I/O capacitance value
[Temperature_Range]     typ min max 
[Pullup Reference]      typ min max
[Pulldown Reference]    typ min max
[POWER Clamp Reference] typ min max
[GND Clamp Reference]   typ min max
[Receiver Reference]    type min max
  (The voltage range keywords are used a bit differently than in IBIS.
These keywords indicate the voltage at the associated model port. For a
traditional behavioral simulator these value still end up being the
references for the I/V curves.  For an IBIS-X simulator they would be a
fixed voltage at the pins, and a structural description can be used to put
a package model in between the pin (port) and the buffer model itself.  For
a pure SPICE simulator (where the board level power distribution is
modeled) these keywords serve mostly as documentation.)
[Driver Spec]
  (timing test loads, Vmeas, etc.  Use if a model is an output or I/O)
[Receiver Spec]
  (input thresholds, overshoot/undershoot thresholds, etc. Use if a model 
   is a receiver or I/O) 
[Port list] 
port_name port_type
  (port types are: 
      primary_io   | primary I/O pin
      pullup_ref   | power connection pin
      pulldown_ref | power connection pin
      pwrclamp_ref | power connection pin
      gndclamp_ref | power connection pin
      rcvr_ref     | power connection pin
      gnd          | reference pin
      ctl          | a digital (1/0) control pin
      analog       | an analog control pin
      stim_in      | external stimulus (not a component pin)
      recevier_out | output of a receiver (not a component pin)
   )
[Begin Model Description]
description_type =  behavioral | structural 

  (put the guts of the model here)

[End Model Description]
[End Model]

MODEL DESCRIPTIONS 
  A model can be described in one of three forms: A conventional behavioral
(IBIS) description, a nodal description that interconnects submodels and
passive components, or a call to an external file.


For a traditional IBIS description, the following keywords are supported 
(initial list).
[Pullup]/[Pulldown]/[POWER Clamp]/[GND Clamp]
[Rising Waveform]/[Falling Waveform]
[Ramp]
[TTgnd]/[TTpower]
[Driver Schedule]  (replace by IBIS submodel mechanism?)
[Add Submodel]
[SubModel]

   (Note: The keywords that support series switches, series devices, or
terminator networks have not been included.  Given that these devices are
adequately supported in IBIS, or could be described using a circuit
description, I have not included them in the initial list.)


A nodal description connects passive components, submodels and independent
voltage and current sources together.  Transistors are not supported, but 
a general three terminal device is included.  Syntax would be some most
common denominator of the existing SPICE variants.

Rxxx  node1  node2    value= explicit value or equation  (resistance)
Lxxx  node1  node2    value= explicit value or equation  (inductance)
Cxxx  node1  node2    value= explicit value or equation  (capacitance)
Vxxx  node1  node2    value= explicit value, equation or table  (V source)
Ixxx  node1  node2    value= explicit value, equation or table  (I source)
Sxxx  node1  node2 node3 value = equation or table(s) (three terminal device)
Xxxx  port1=>node1, port2=>node2, ...parameter1=>value,... (submodel)

Finally, the guts of a model (or a submodel in a nodal or IBIS description)
could be a call to an externally defined model that the simulator executes
via an API (applications programming interface).  The syntax of the call
has yet to be worked out, but one would expect something like

Xxxx port1=>node1, port2=>port2,... parameter1=>"path to model file", ...)

One question that has been puzzling me is the mechanism used to apply
stimulus to the external model. Does the simulator simply flip the stim_in
node from '0' to '1', or does the user have to attach an explicit stimulus
source?  


SUBMODELS
Submodels are used both by behavioral descriptions ([Submodel] statements)
and nodal descriptions (Xxxx calls).  Submodels are a lot like top level
[Models], but they do not include any of the top level simulation
information nor can they connect directly to a component pin.  Again,
behavioral, structural and calls to external models are supported.  In
addition, a submodel can support a matrix type description of a passive
network.


[Begin Submodel]  submodel_name
description_type = behavioral | structural | matrix
[Port List]
  (port name, but do we need a description??)

  (put description of submodel here)

[End Submodel]

[End]


From owner-ibis  Fri Nov 12 13:22:48 1999
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Date: Fri, 12 Nov 1999 15:18:15 +0000
Message-ID: <000750D7.CE21031@molex.com>
Subject: Re:IBIS-X proposal
To: ibis@eda.org, ibis-users@eda.org
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Stephen and other "IBISians"

For what it is worth....  When I initially started with the IBISCnn
specification (IBISCnn = IBIS Connector Specification)....  I really tried to
incorporate a nodal methods. And, for what it is worth,  I still think it would
be a powerful addition.  However, at the time  (and maybe still) there seemed to
be a lot of resistance to incorporating a "SPICE deck like approach" in the IBIS
specification.


Further,  I really like the inclusion of the PWR/GND  (or maybe more
specifically, current return path) references.  For what it is worth, these have
been included in the IBISCnn specification (soon to be available for your
critical reviews).  As such, after IBISCnn is available,  I would greatly
appreciate your comments.


If it would help the group, I would also suggest that the IBISCnn RLCs
interconnection metodology may address Stephans: "package model consisting of a
network of R/L/Cs (a SPICE like description). Therefore, the IBIS-X proposal
allows the guts of a model to be a nodal network consisting of passive
components".

As such, maybe it may also be possible to represent " some basic independent and
dependent sources"  in the same "matrix" format.

Also, it is important to know that the IBISCnn specification does incorporate
"NO GROUND" models.  Unfortunately, this functionality is lost if a simulator
insists on having "perfect ground" reference points on both sides of a
connector.


Best Regards,
_gus


____________________Reply Separator____________________
Subject:    IBIS-X proposal
Author: Stephen Peters <sjpeters@ichips.intel.com>
Date:       11/12/99 12:42 PM


Hello All:

  At the recent IBIS summit there was a fair amount of discussion regarding
the future of IBIS.  Among the issues the IBIS community has been wrestling
with are:
1. the growth in complexity of the specification, 
2. support for power/gnd and return path modeling
3. receiver modeling, and 
4. the need for a general escape mechanism that allows simulators to 
incorporate user created models (models that the simulator may not otherwise 
support).

  So far, there has been a proposal for incorporating an API (application
programming interface) into IBIS, which addresses point four above.  However, 
to fully support an API I belive that the current IBIS description would have 
to change.  Specifically, models would have to become multi-ported
entities with explicit power and ground ports tied to component pins.  In 
fact, I belive to in order to fully address the problems of complexity 
(added keywords for every new type of buffer) and return path modeling there
needs to be a new, general buffer description language, one that supports IBIS
type simulators but also allows a model to be used directly by a circuit
simulator.  To that end I'm making a proposal called IBIS-X.  I am aware that
this is a fairly radical proposal (for example, it is not backwards compatible
with the existing IBIS specification), but I belive it does address directly
both the needs of those producing models as well as those designing high 
speed electrical interconnects.

Please look it over and make your comments.  This will be on the agenda at
the next IBIS phone conference.

   Best Regards,
   Stephen Peters
   Intel Corp.

From owner-ibis  Fri Nov 12 21:26:12 1999
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Date: Fri, 12 Nov 1999 21:25:36 -0800
From: Scott McMorrow <scott@vasthorizons.com>
Reply-To: scott@vasthorizons.com
Organization: SiQual
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To: ibis <ibis-users@eda.org>, Jim Bell <jimb@teleport.com>,
        Richard Gaunt <richardg@aplayers.com>, bernard <bjvoss@vernonia.com>,
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Subject: [Model Spec] Vref  Addition.
Content-Type: multipart/mixed;
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All,

I would like to submit the following Bird on behalf of
SiQual to modify the current [Model Spec].  It is
attached below

regards,

scott

Scott McMorrow
Principal Engineer
SiQual, Signal Quality Engineering
18735 SW Boones Ferry Road
Tualatin, OR  97062-3090
(503) 885-1231
http://www.siqual.com


******************************************************************************
******************************************************************************

BIRD ID#:
ISSUE TITLE:    [Model Spec] Vref Addition
REQUESTER:      Scott McMorrow, SiQual
DATE SUBMITTED: November 12, 1999
DATE ACCEPTED BY IBIS OPEN FORUM: xxxx

******************************************************************************
******************************************************************************

STATEMENT OF THE ISSUE:

Vref may need to be different for min and max columns.

******************************************************************************

STATEMENT OF THE RESOLVED SPECIFICATIONS:

Changes and additions to the [Model Spec] keyword are shown by the |* lines
to add Vref with typ-min-max values:


|=============================================================================
|     Keyword:  [Model Spec]
|    Required:  No
|  Sub-Params:  Vinh, Vinl, Vinh+, Vinh-, Vinl+, Vinl-, S_overshoot_high,
|               S_overshoot_low, D_overshoot_high, D_overshoot_low,
|               D_overshoot_time, Pulse_high, Pulse_low, Pulse_time, Vmeas
|*             Vref
| Description:  The [Model Spec] keyword defines four columns under which
|               specification subparameters are defined.
|
|               The following subparameters are defined:
|               Vinh               Input voltage threshold high
|               Vinl               Input voltage threshold low
|               Vinh+              Hysteresis threshold high max Vt+
|               Vinh-              Hysteresis threshold high min Vt+
|               Vinl+              Hysteresis threshold low max Vt-
|               Vinl-              Hysteresis threshold low min Vt-
|               S_overshoot_high   Static overshoot high voltage
|               S_overshoot_low    Static overshoot low voltage
|               D_overshoot_high   Dynamic overshoot high voltage
|               D_overshoot_low    Dynamic overshoot low voltage
|               D_overshoot_time   Dynamic overshoot time
|               Pulse_high         Pulse immunity high voltage
|               Pulse_low          Pulse immunity low voltage
|               Pulse_time         Pulse immunity time
|
|               Vmeas              Measurement voltage for timing measurements
|*               Vref                  Timing specification test load voltage
|
| Usage Rules:  [Model Spec] must follow all other subparameters under the
|               [Model] keyword.
|
|               For each subparameter contained in the first column, the
|               remaining three hold its typical, minimum and maximum values.
|               The entries of typical, minimum and maximum be must be placed
|               on a single line and must be separated by at least one white
|               space or tab character.  All four columns are required under
|               the [Model Spec] keyword.  However, data is required only in
|               the typical column.  If minimum and/or maximum values are not
|               available, the reserved word "NA" must be used indicating the
|               typical value by default.
|
|               The minimum and maximum values are used for specifications
|               subparameter values that may track the min and max operation
|               conditions of the [Model].  Usually it is related to the
|               Voltage Range settings.
|
|               Unless noted below, each subparameter does not require having
|               any other subparameter.
|
|               Vinh, Vinl rules:
|
|               The threshold subparameter lines provide additional min and
|               max column values, if needed.  The typ column values are still
|               required and would be expected to override the Vinh and Vinl
|               subparameter values specified elsewhere.  Note: the syntax
|               rule that require inserting Vinh and Vinl under models remains
|               unchanged even if the values are defined under the [Model
|               Spec] keyword.
|
|               To mimic a hysteresis effect, the values of Vinh and Vinl may
|               be interchanged such that the Vinl value is larger than the
|               Vinh value.  However, simulators may process this information
|               differently or report an error.
|
|               Vinh+, Vinh-, Vinl+, Vinl- rules:
|
|               The four hysteresis subparmeters must all be defined before
|               the hysteresis threshold rules become effective.  Otherwise
|               the standard threshold subparameters remain in effect.  The
|               hysteresis thresholds shall be at the Vinh+ and Vinh- values
|               for a low-to-high transition, and at the Vinl+ and Vinl-
|               values for a high-to-low transition.
|
|               S_overshoot_high, S_overshoot_low rules:
|
|               The static overshoot subparameters provide the voltage values
|               for which the model is no longer guaranteed to function
|               correctly.
|
|               D_overshoot_high, D_overshoot_low, D_overshoot_time rules:
|
|               The dynamic overshoot values provide a time window during
|               which the overshoot may exceed the static overshoot limits
|               but be below the dynamic overshoot limits.  D_overshoot_time
|               is required for dynamic overshoot testing.  In addition, if
|               D_overshoot_high is specified, then S_overshoot_high is
|               necessary for testing beyond the static limit.  Similarly, if
|               D_overshoot_low is specified, then S_overshoot_low is
|               necessary for testing beyond the static limit.
|
|               Pulse_high, Pulse_low, Pulse_time rules:
|
|               The pulse immunity values provide a time window during which
|               a rising pulse may exceed the nearest threshold value but
|               be below the pulse voltage value and still not cause the
|               input to switch.  Pulse_time is required for pulse immunity
|               testing.  A rising response is tested only if Pulse_high is
|               specified.  Similarly, a falling response is tested only if
|               Pulse_low is specified.  The rising response may exceed the
|               Vinl value, but remain below the Pulse_high value.
|               Similarly, the falling response may drop below the Vinh value,
|               but remain above the Pulse_low value.  In either case the
|               input is regarded as immune to switching if the responses
|               are within these extended windows.  If the hysteresis
|               thresholds are defined, then the rising response shall use
|               Vinh- as the reference voltage, and the falling response shall
|               use Vinl+ as the reference voltage.
|
|              Vmeas rules:
|
|              The Vmeas values under the [Model Spec] keyword override the
|              Vmeas entry elsewhere.
|*
|*             Vref rules:
|*             The Vref values under the [Model Spec] keyword override the
|*             Vref entry elsewhere

|-----------------------------------------------------------------------------
[Model Spec]
|   Subparameter          typ        min        max
|
| Thresholds
|
Vinh                      3.5        3.15       3.85    | 70% of Vcc
Vinl                      1.5        1.35       1.65    | 30% of Vcc
|
| Vinh                    3.835       3.335     4.335   | Offset from Vcc
| Vinl                    3.525       3.025     4.025   | for PECL
|
| Hysteresis
|
Vinh+                     2.0        NA         NA      | Overrides the
Vinh-                     1.6        NA         NA      | thresholds
Vinl+                     1.1        NA         NA
Vinl-                     0.6        NA         NA      | All 4 are required
|
| Overshoot
|
S_overshoot_high          5.5        5.0        6.0     | Static overshoot
S_overshoot_low          -0.5        NA         NA
D_overshoot_high          6.0        5.5        6.5     | Dynamic overshoot
D_overshoot_low          -1.0       -1.0       -1.0     | requires
|                                                       | D_overshoot_time
D_overshoot_time          20n        20n        20n     | & static overshoot
|
| Pulse Immunity
|
Pulse_high                3V         NA         NA      | Pulse immunity
Pulse_low                 0          NA         NA      | requires
Pulse_time                3n         NA         NA      | Pulse_time
|
| Timing Thresholds
|
Vmeas                     3.68       3.18       4.68    | A 5 volt PECL
|                                                       | example
|


|*** ADDED EXAMPLE BELOW:
| Timing test load voltage reference example
|
Vref                   1.25 1.15   1.35    |  An SSTL-2 example
|
|*** END OF ADDED EXAMPLE
|=============================================================================


******************************************************************************

ANALYSIS PATH/DATA THAT LED TO SPECIFICATION:

BIRDxx is issued because the Timing specification test load voltage
value Vref defined under the [Model] keyword changes with the Vcc
reference voltage for some technologies (such as SSTL-2) when used
for the min or max column.  This will cause incorrect timing test load
corrections to be created for the min and max corners.

Adding Vref to the [Model Spec] section is necessary to correctly
simulate output timing and skew across the entire process range.
A simple typical Vref value, as is currently used, will cause some
simulators to report incorrect delay due to improper measurement
of the output timing parameters.

Device output timing specifications for SSTL-2 for DDR devices
are guaranteed into the following standard load for the typical
case:

Cref = 30.000000pF
Vref = 1.50000V
Rref = 50.000000

For the minimum case:

Cref = 30.000000pF
Vref = 1.15000V
Rref = 50.000000

For the maximum case:

Cref = 30.000000pF
Vref = 1.35000V
Rref = 50.000000

It is impossible to correlate device output performance to
only a typical test load with the current method.  This enhancement
to the [Model Spec] was incorrectly excluded from the previous
BIRD 55.

The inclusion of a simple timing measurement threshold region
should also be considered for inclusion into this bird.

******************************************************************************

ANY OTHER BACKGROUND INFORMATION:


******************************************************************************



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begin:vcard 
n:McMorrow;Scott
tel;work:503-708-4320
x-mozilla-html:FALSE
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org:SiQual, Signal Quality Engineering
adr:;;18735 SW Boones Ferry Road;Tualatin ;OR;97062-3090;USA
version:2.1
email;internet:scott@vasthorizons.com
title:Principal Engineer
note:asdfsdaf
fn:Scott McMorrow
end:vcard

--------------EC2FE05C7413B71C28CBD109--

From owner-ibis  Fri Nov 12 21:52:56 1999
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Date: Fri, 12 Nov 1999 21:52:18 -0800
From: Scott McMorrow <scott@vasthorizons.com>
Reply-To: scott@vasthorizons.com
Organization: SiQual
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Subject: IBIS Bird 64 - Package Model Selector suggested changes
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All,

SiQual would like to suggest that we add min, typ and
max columns to the Bird 64 - Package Model Selector.
This will allow a simple mechanism for defining
multiple package corners that are logically associated
with a particular package type.

A simulator would select a package type using the
Package Type column.

A simulator would select a package corner using
the Typ, Min and Max columns.

These selections can be made independently within
the simulator in order to "sweep" the entire design
space.


See below.

regards,

scott


--
Scott McMorrow
Principal Engineer
SiQual, Signal Quality Engineering
18735 SW Boones Ferry Road
Tualatin, OR  97062-3090
(503) 885-1231
http://www.siqual.com



|
[Package Model Selector]
|
| Package Type                      typ                      min                               max
|
 Documentation of 208-BGA package model typ, min and max corner extractions.
|208-BGA-pkg-single      BGA  - Single switched line equivalent package
|                                                       All other lines quiescent
|208-BGA-pkg-odd        BGA  - Odd mode single line equivalent package
|208-BGA-pkg-even      BGA  - Even mode single line equivalent package
|
208-BGA             208-BGA-pkg-single    208-BGA-pkg-odd    208-BGA-pkg-even
|
|
|Documentation of 208-PQFP package model typ, min and max corner extractions.
|208-PQFP-pkg-single  PQFP - Single switched line equivalent package
|                                                       All other lines quiescent
|208-PQFP-pkg-odd     PQFP - Odd mode single line equivalent package
|208-PQFP-pkg-even    PQFP - Even mode single line equivalent package
|
208-PQFP           208-PQFP-pkg-single    208-PQFP-pkg-odd    208-PQFP-pkg-even
|

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begin:vcard 
n:McMorrow;Scott
tel;work:503-708-4320
x-mozilla-html:FALSE
url:www.siqual.com
org:SiQual, Signal Quality Engineering
adr:;;18735 SW Boones Ferry Road;Tualatin ;OR;97062-3090;USA
version:2.1
email;internet:scott@vasthorizons.com
title:Principal Engineer
note:asdfsdaf
fn:Scott McMorrow
end:vcard

--------------1CEDB8873D88051E438C6ED3--

From owner-ibis  Mon Nov 15 13:25:10 1999
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Date: Mon, 15 Nov 1999 13:24:07 -0800 (PST)
From: Syed Huq <shuq@cisco.com>
Reply-To: Syed Huq <shuq@cisco.com>
Subject: Re: IBIS connector specification released to open forum
To: ibis@eda.org, apanella@molex.com, kellee@hyperlynx.com
Cc: ibis-users@eda.org, shuq@cisco.com
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The IBIS website has been updated with a link 'Connector Info' on the main
page http://www.eia.org/eig/ibis/ibis.htm. Select the link.

Then download the two document(ver 0.92):

IbisConSpec_v092.txt
IbisConUpdates_v092.txt

Regards,
Syed
Webmaster
Cisco Systems, Inc

> 
> Hi IBIS fans,
> 
>   The IBIS connector sub-group today completed work
> on the final draft of the connector specification V0.92.
> 
> I forwarded the specification along with a changes document
> to Syed to have it placed on the IBIS web site.
> 
>   Please accept this email as the official notification from
> the connector sub-group to the IBIS open forum that we are
> releasing the connector specification to you.
> 
>  I chose not to send the entire specification to the whole
> IBIS group as it is around 1600 lines long.  It should be
> available to the general public as soon as Syed can get it
> put on the web site.
> 
> NOTICE: This is not a released specification!  This version is
> the release from the sub-group to the full group.
> 
> What remains to be done:
> 
> 1) Full open forum must comment and changes if any included
>    in the document.
> 2) It must be voted on and approved by the open forum.
> 3) A Golden parser must be written to insure that models developed
>    have no syntax errors.  Along with this development the existing
>    golden example models provided by the connector sub group must be 
>    improved to comply with the current specification.
> 4) Existing connector model creation and simulation methods should 
>    be enhanced to support the new IBIS connector format.  
>    This might effect connector manufacturers as well as CAE tool suppliers.
> 
> This is the end of a nearly 2 year project for the people involved.
> I know many of you will not be 100% happy with
> the result but please don't forget that we are a large group and
> must forge a result that is acceptable to the majority.
> Also consider that this specification is long over due and it is the
> 2nd attempt by the IBIS group to create a connector specification.
> So please be gentle in your criticism ....
> 
> Please direct your comments to the normal IBIS reflector
> both Gus and I will be watching for your questions
> and will do our best to answer them.
> 
> best wishes...
> Kellee Crisafulli, PADS software/Hyperlynx
> Gus Panella, Mollex
> 
> ***************************************************************
> Members of the IBIS connector sub-group and others that have
> assisted with developing with this specification.
>    Eric Bogatin,        Ansoft/Bogatin Enterprises
>    Steve Chau,          AMP
>    Kellee Crisafulli,   PADS software/HyperLynx
>    John Ellis,          Berg
>    Mark Gailus,         Teradyne 
>    Fran Hart,           Dell
>    Bob Haller,          Compaq
>    Jay Diepenbrock,     IBM
>    Mikhail Khusid,      Teradyne
>    Igor Kochikov,       PADS software/HyperLynx
>    Gus Panella,         Mollex Inc.
>    Katie Rothstein,     Teradyne   
>    Guy de Burgh,        Viewlogic Systems
>    Jeff Walden,         AMP/Foxconn
>    Fabrizio Zanella,    EMC corp
> 
> ---------------------------------------------------------
> Have a great day....
> Kellee Crisafulli 
> HyperLynx, a division of Pads Software Inc.
> SI,EMC,X-talk and IBIS tools for the Windows platform
> E-mail: <mailto:kellee@hyperlynx.com>
> web:    <http://www.hyperlynx.com>
> ---------------------------------------------------------
> 
> 

From owner-ibis  Tue Nov 16 08:24:48 1999
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Message-ID: <8525682B.005A12F0.00@D51MTA05.pok.ibm.com>
Date: Tue, 16 Nov 1999 10:23:36 -0600
Subject: IBIS datasheets for PCI and DDR
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Hello All,

My modeling group has a need for a generic IBIS datasheet that would
represent the full range of the PCI spec.  I guess it would be pretty easy
to make from the spec (except the VT tables), but I figured why reinvent
the wheel.  A behavioral HSPICE model would be nice, too.  We're planning
to use these models in simulations to evaluate spec compliance.

I'm also looking for the same thing for the DDR SDRAM spec.

Greg Edlund
Advisory Engineer, Critical Net Analysis
IBM
3650 Hwy. 52 N, Dept. HDC
Rochester, MN 55901
gedlund@us.ibm.com


From owner-ibis  Tue Nov 16 10:44:26 1999
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From: "Chris Cheng" <hycheng@3pardata.com>
To: <si-list@silab.eng.sun.com>
Cc: <ibis-users@vhdl.org>
Subject: RE: [SI-LIST] : IBIS datasheets for PCI and DDR
Date: Tue, 16 Nov 1999 10:41:27 -0800
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try this for DDR model
http://www.micron.com/mti/msp/models/index.html
spice only for DDR i/o but then again, why do
u need ibis if u have the full spice......
chris

> -----Original Message-----
> From: owner-si-list@silab.eng.sun.com
> [mailto:owner-si-list@silab.eng.sun.com]On Behalf Of gedlund@us.ibm.com
> Sent: Tuesday, November 16, 1999 8:24 AM
> To: si-list@silab.eng.sun.com
> Cc: ibis-users@vhdl.org
> Subject: [SI-LIST] : IBIS datasheets for PCI and DDR
>
>
> Hello All,
>
> My modeling group has a need for a generic IBIS datasheet that would
> represent the full range of the PCI spec.  I guess it would be pretty easy
> to make from the spec (except the VT tables), but I figured why reinvent
> the wheel.  A behavioral HSPICE model would be nice, too.  We're planning
> to use these models in simulations to evaluate spec compliance.
>
> I'm also looking for the same thing for the DDR SDRAM spec.
>
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com
>
>
>
> **** To unsubscribe from si-list: send e-mail to
> majordomo@silab.eng.sun.com. In the BODY of message put:
> UNSUBSCRIBE si-list, for more help, put HELP.  si-list archives
> are accessible at http://www.qsl.net/wb6tpu/si-list ****
>
>

From owner-ibis  Mon Nov 22 12:32:06 1999
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From: "D. C. Sessions" <dc.sessions@vlsi.com>
Organization: VLSI Technology Inc.
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To: gedlund@us.ibm.com
CC: si-list@silab.eng.sun.com, ibis-users@vhdl.org
Subject: Re: IBIS datasheets for PCI and DDR
References: <8525682B.005A12F0.00@D51MTA05.pok.ibm.com>
Content-Type: multipart/mixed;
 boundary="------------745FA3F7A16517A621904AA5"

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gedlund@us.ibm.com wrote:
> 
> Hello All,
> 
> My modeling group has a need for a generic IBIS datasheet that would
> represent the full range of the PCI spec.  I guess it would be pretty easy
> to make from the spec (except the VT tables), but I figured why reinvent
> the wheel.  A behavioral HSPICE model would be nice, too.  We're planning
> to use these models in simulations to evaluate spec compliance.
> 
> I'm also looking for the same thing for the DDR SDRAM spec.
> 
> Greg Edlund
> Advisory Engineer, Critical Net Analysis
> IBM
> 3650 Hwy. 52 N, Dept. HDC
> Rochester, MN 55901
> gedlund@us.ibm.com

I've attached some behavioral HSPICE models for DDR 4x;
the same approach should work for PCI.

-- 
D. C. Sessions
dc.sessions@vlsi.com
--------------745FA3F7A16517A621904AA5
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 name="vi_functions.inc"
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* AGP 2.0 V/I curve functions
* Source:
*         AGP specification  rev. 2.0 Figure 4-29 (3.3v)
*         AGP specification  rev. 2.0 Figure 4-30 (1.5v)
*         AGP specification  rev. 2.0 Figure 4-33 (1.5v)

* Maximum pullup current at 3.3v
.SUBCKT	ioh33max	pad	vddq	vssq
E1	vddq	offs
+	VOL='0.3*v(vddq,vssq)'
E2	offs	pad
+	VOL='((i(E1)/54m)*v(vddq,vssq)/(v(pad,vssq)+(0.4*v(vddq,vssq))))-v(vddq,offs)'
+	MAX=0
.ENDS	ioh33max

* Maximum pulldown current at 3.3v
.SUBCKT	iol33max	pad	vddq	vssq
E1	offs	vssq
+	VOL='0.18*v(vddq,vssq)'
E2	pad	offs
+	VOL='((i(E1)/141m)*v(vddq,vssq)/v(vddq,pad))-v(offs,vssq)'
+	MAX=0
.ENDS	iol33max

* Minimum pullup current at 3.3v
.SUBCKT	ioh33min	pad	vddq	vssq
.PARAM
+ rline	= '0.7/9m'
E1	vddq	offs	VOL='0.1*v(vddq,vssq)'
E2	offs	pad
+	VOL='(i(E2)*rline)-v(vddq,offs)'
+	MIN=0	MAX=4
G1	offs	pad
+	CUR='(v(vddq,vssq)*0.7/rline)-i(E2)'	MIN=-50m	MAX=0
R1	vddq	pad	1e8
.ENDS	ioh33min

* Minimum pulldown current at 3.3v
.SUBCKT	iol33min	pad	vddq	vssq
.PARAM
+ rline	= '0.6/12m'
E1	offs	vssq	VOL='0.1*v(vddq,vssq)'
E2	pad	offs
+	VOL='(i(E2)*rline)-v(offs,vssq)'
+	MIN=0	MAX=4
G1	pad	offs
+	CUR='(v(vddq,vssq)*0.6/rline)-i(E2)'
+	MIN=-50m	MAX=0
R1	pad	vssq	1e8
.ENDS	iol33min

* 1.5v constraint curves

* Maximum pullup current at 1.5v (per 4-30)
.SUBCKT	ioh15max1	pad	vddq	vssq
E1	vddq	offs
+	VOL='0.3*v(vddq,vssq)'
E2	offs	pad
+	VOL='((i(E1)/111m)*v(vddq,vssq)/v(pad,vssq))-v(vddq,offs)'
+	MAX=0
.ENDS	ioh15max1

* Maximum pulldown current at 1.5v (per 4-30)
.SUBCKT	iol15max1	pad	vddq	vssq
E1	offs	vssq
+	VOL='0.3*v(vddq,vssq)'
E2	pad	offs
+	VOL='((i(E1)/111m)*v(vddq,vssq)/v(vddq,pad))-v(offs,vssq)'
+	MAX=0
.ENDS	iol15max1

* Minimum pullup current at 1.5v (per 4-30)
.SUBCKT	ioh15min1	pad	vddq	vssq
.PARAM
+ rline	= '0.675/11m'
E1	vddq	offs	VOL='0.1*v(vddq,vssq)'
E2	offs	pad
+	VOL='(i(E2)*rline)-v(vddq,offs)'
+	MIN=0	MAX=2
G1	offs	pad
+	CUR='(v(vddq,vssq)*0.675/rline)-i(E2)'	MIN=-50m	MAX=0
R1	vddq	pad	1e8
.ENDS	ioh15min1

* Minimum pulldown current at 1.5v (per 4-30)
.SUBCKT	iol15min1	pad	vddq	vssq
.PARAM
+ rline	= '0.675/11m'
E1	offs	vssq	VOL='0.1*v(vddq,vssq)'
E2	pad	offs
+	VOL='(i(E2)*rline)-v(offs,vssq)'
+	MIN=0	MAX=2
G1	pad	offs
+	CUR='(v(vddq,vssq)*0.675/rline)-i(E2)'
+	MIN=-50m	MAX=0
R1	pad	vssq	1e8
.ENDS	iol15min1

* Maximum pullup current at 1.5v (per 4-33)
.SUBCKT	ioh15max2	pad	vddq	vssq
.PARAM
+ ib1		= '200m/9'
E1	vddq	pad2	VOL='MIN(v(vddq,pad),v(vddq,vssq)/2)
G1	vddq	pad
+	CUR='ib1*(v(vddq,pad)+(v(pad2,vssq)*v(vddq,pad2)/v(vddq,vssq)))'
R1	vddq	pad	1e8
.ENDS	ioh15max2

* Maximum pulldown current at 1.5v (per 4-33)
.SUBCKT	iol15max2	pad	vddq	vssq
.PARAM
+ ib1		= '200m/9'
E1	pad2	vssq	VOL='MIN(v(pad,vssq),v(vddq,vssq)/2)
G1	pad	vssq
+	CUR='ib1*(v(pad,vssq)+(v(pad2,vssq)*v(vddq,pad2)/v(vddq,vssq)))'
R1	pad	vssq	1e8
.ENDS	iol15max2

* Minimum pullup current at 1.5v (per 4-33)
.SUBCKT	ioh15min2	pad	vddq	vssq
.PARAM
+ k1	= 48		$ 1/20.833m
+ k2	= 600		$ 1/1.667m
+ k3	= 'k2-k1'
E1	n1	vddq	VOL='MIN(-0.15*v(vddq,vssq),48*i(E1))'
E2	pad	n1	VOL='MIN(0,k3*(i(E1)+(0.5*v(vddq,vssq)/k1)))'
.ENDS	ioh15min2

* Minimum pulldown current at 1.5v (per 4-33)
.SUBCKT	iol15min2	pad	vddq	vssq
.PARAM
+ k1	= 48		$ 1/20.833m
+ k2	= 600		$ 1/1.667m
+ k3	= 'k2-k1'
E1	n1	vssq	VOL='MAX(0.15*v(vddq,vssq),48*i(E1))'
E2	pad	n1	VOL='MAX(0,k3*(i(E1)-(0.5*v(vddq,vssq)/k1)))'
.ENDS	iol15min2


--------------745FA3F7A16517A621904AA5--

From owner-ibis  Wed Nov 24 08:58:08 1999
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Date: Wed, 24 Nov 1999 08:57:02 -0800 (PST)
From: Syed Huq <shuq@cisco.com>
Reply-To: Syed Huq <shuq@cisco.com>
Subject: Re: Help
To: ibis-users@eda.org, ibis@vhdl.org, sunweifeng@huawei.com.cn
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Look at your 'putout.out' or 'putout.st0' file for errors..

Syed

> Date: Wed, 24 Nov 1999 20:54:50 +0800
> From: sunweifeng <sunweifeng@huawei.com.cn>
> MIME-Version: 1.0
> To: ibis-users <ibis-users@cda.org>, "ibis-vhdl.org" <ibis@vhdl.org>
> Subject: Help
> X-SMTP-HELO: server.eda.org
> X-SMTP-MAIL-FROM: owner-ibis@server.eda.org
> X-SMAP-Received-From: outside
> X-SMTP-PEER-INFO: server.eda.org [171.64.101.101]
> 
> Hi Sir,
> 
>   I used the s2ibis2 to transit the spice model to ibis model. I run the
> demo under the directory ex1, and there following note when run
> "s2ibis2.solaris buffer.s2i" :
> s2ibis2.solaris v1.1 -- North Carolina State University
> s2ibis2.solaris: Reading input file buffer...done.
> s2ibis2.solaris: Analyzing component MCM Driver .
> s2ibis2.solaris: Starting HSpice job with input putout.spi.
> s2ibis2.solaris: Error in executing HSpice.
> s2ibis2.solaris: Error 0
> s2ibis2.solaris: Fatal error.
>   However it is OK when run "hspice buffer.sp", would please tell me
> why?
> Thank you very much.
> 
> Best Regards,
> 
> 
> Sun Weifeng

From owner-ibis  Tue Nov 30 08:06:36 1999
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Hello all,

    I am currently trying to get acquainted with the s2ibis2 utility but
I am running into some problems. I am using Star-Hspice 98.2 as my
simulator. On the second example, the tristate buffer, I keep getting
errors and hspice aborting the simulation. The errors deal with
non-convergence but I do not know how to fix them, I have already added
a 1 ohm resistor on the output as advised by Alan Glaser the author of
s2ibis2. Hspice craps out when trying to gather the data for the max
pulldown output disabled curve, it then gives the following error:

**warning** both nodes of source     0:vgnds2i
            are connected together

**warning** negative-mos conductance =     0:mx24             iter=   21

vds,vgs,vbs =       24.3         0.594         -3.67
 gm,gds,gmbs,ids=     4.697E-04     3.444E-05    -4.614E-06
2.122E-04
convergence problems in dc sweep curves at -0.30000
 resimulating with dc convergence controls


**diagnostic** dc convergence failure,
resetting dcon option to 1 and retrying


**diagnostic** dc convergence failure,
resetting dcon option to 2 and retrying.




*** error ***: no convergence in dc sweep curves at -0.30000

    The first warning does not stop hspice from completing the
simulation but I would like to know what it means and how can it be
fixed.

Thank you for your time. Long live IBIS!

Gerald Truong
Motorola Computer Group
(602)438-3525.


From owner-ibis  Tue Nov 30 09:07:07 1999
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Date: Tue, 30 Nov 1999 09:05:24 -0800 (PST)
From: Syed Huq <shuq@cisco.com>
Reply-To: Syed Huq <shuq@cisco.com>
Subject: Re: s2ibis2 problems
To: ibis-users@eda.org, gtruong@eng.mcd.mot.com
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This is a very typical problem. For example, most devices will fail DC 
convergence if you are sweeping at the extreme ranges required for IBIS(ie, 
-Vdd to +2Vdd).

You need to tweak your sweep range. At -0.3V, it fails to converge. You can
do this by editing your .spi file and manually changing the sweep range.
Try a range from 0.0 to 3.3V

Regards,
Syed
Cisco Systems, Inc

> convergence problems in dc sweep curves at -0.30000
>  resimulating with dc convergence controls
> 
> 
> **diagnostic** dc convergence failure,
> resetting dcon option to 1 and retrying
> 
> 
> **diagnostic** dc convergence failure,
> resetting dcon option to 2 and retrying.
> 
> 
> 
> 
> *** error ***: no convergence in dc sweep curves at -0.30000
> 

From owner-ibis  Tue Nov 30 22:51:30 1999
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Date: Wed, 01 Dec 1999 15:57:46 +0900
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  <k.mori@zuken.co.jp>
Subject: about "Waveform","Vmeas","Rref","Cref","Vref"
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Hello all

Please tell me about the next two items.

The first item is about "Waveform".  Why was this item made ?  And  How was 
this item used ?  I often see this item in an IBIS model, but not useful eno
ugh.

The second item is about "Vmeas", "Rref", "Cref", and "Vref".  These items a
re used for a propagation delay.  So,  are these items "TEST LOAD" to get AC
 characteristics written into IC vendor's data-sheets ?

Best Regards
k.mori
==================================================
$B@9(B  $B7r<!(B(Kenji Mori)
$B3t<02q<R(B  $B?^8&(B
EDA$B;v6HIt(B  $B%G%6%$%s!&%$%N%Y!<%7%g%s;v6H?d?JIt(B  DI$B5;=Q?d?J2](B        
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$B")(B224-8585 $B2#IM;TETC^6h1AEDEl(B2-25-1
Phone: 045-942-7787; Fax: 045-942-1915
E-mail: k.mori@zuken.co.jp    URL: http://www.zuken.co.jp
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